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Sub-1G - BDE-SG1311P3(Sub-1G with PA Based on CC1311P3)
  • BDE-SG1311P3(Sub-1G with PA Based on CC1311P3)


    BDE-SG1311P3 is a multiprotocol Sub-1 GHz wireless module supporting IEEE 802.15.4g, IPv6-
    enabled smart objects (6LoWPAN), mioty, Wi-SUN®, proprietary systems, including the TI 15.4-
    Stack (Sub-1 GHz). The module is based on an Arm® Cortex® M4 main processor and optimized
    for low-power wireless communication and advanced sensing in grid infrastructure, building
    automation, retail automation, personal electronics and medical applications.

    Key Features

    Wireless microcontroller
    Powerful 48-MHz Arm® Cortex®-M4 processor
    352KB flash program memory
    32KB of ultra-low leakage SRAM
    8KB of Cache SRAM (Alternatively available as
    general-purpose RAM)
    Programmable radio includes support for 2-
    (G)FSK, 4-(G)FSK, MSK, OOK, IEEE 802.15.4 PHY
    and MAC
    Supports over-the-air upgrade (OTA)
    Low power consumption
    MUC consumption
    2.63 mA active mode, CoreMark
    55 μA/MHz running CoreMark
    0.8 μA standby mode, RTC, 32KB RAM
    0.1 μA shutdown mode, wake-up on pin
    Radio Consumption:
    5.4 mA RX at 868 MHz
    24.9 mA TX at +14 dBm at 868 MHz
    64 mA TX at +20 dBm at 915 MHz
    Wireless protocols support
    Wireless M-Bus
    SimpleLink™ TI 15.4-stack
    Proprietary systems
    High performance radio
    -121 dBm for 2.5-kbps long-range mode
    -118 dBm at 9.6 kbps narrowband mode, 868
    -110 dBm at 50 kbps, 802.15.4, 868 MHz
    Output power up to +20 dBm with temperature
    Down to 4 kHz receiver filter bandwidth
    23 GPIOs
    Digital peripherals can be routed to any GPIO
    Four 32-bit or eight 16-bit general-purpose
    12-bit ADC, 200 kSamples/s, 8 channels
    8-bit DAC
    Two comparators
    Programmable current source
    UART, SSI, I2C, I2S
    Real-time clock (RTC)
    Integrated temperature and battery monitor
    Security enablers
    AES 128-bit cryptographic accelerator
    2 / 12
    True random number generator (TRNG)
    Additional cryptography drivers available in
    Software Development Kit (SDK)
    Operating range
    On-chip buck DC/DC converter
    1.8-V to 3.8-V single supply voltage
    -40 to +85°C (By default)
    -40 to +105°C (Contact for customization)
    On board U.FL connector (Part Number: BDESG1311P3AU)
    RF pad output (Part Number: BDE-SG1311P3N)
    24.9 mm x 19 mm x 2.15 mm
    Standards Conformance
    CE-RED (Europe)
    FCC (US)
    ISED (Canada)




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