BDE-BW3551P1 module series is a 2.4GHz and 5GHz dual-band Wi-Fi 6 and Bluetooth 5.4 Low Energy wireless MCU module based on TI's SimpleLink™ Wi-Fi SoC (system-on-chip) CC3551E.
The module series offers the latest standards from Wi-Fi and Bluetooth Low Energy while maintaining compatibility with Wi-Fi 4 (802.11 a/b/g/n) and Wi-Fi 5 (802.11 ac).
The module series is an excellent choice to use in cost-sensitive embedded applications with RTOS software, bringing the efficiency of Wi-Fi 6 to embedded device applications for the Internet of Things (IoT), with a small PCB footprint and highly optimized bill of materials.
In order to meet different integration requirements, BDE offers different variants for this module series.
Microcontroller
• Powerful
160MHz Arm®Cortex®-M33 processor with FPU, TrustZone®, and AI acceleration
• High-speed
quad-SPI for XiP flash with on-the-fly decryption
• Flexible
configuration of low-latency TCM (up to 32KB) and Cache (32KB or 64KB) for
improved code execution performance
• 1.1MB
embedded SRAM including 128KB TCM for Wi-Fi™, Bluetooth® Low Energy,
networking, and ap plication data
Peripherals
• Up
to 29 I/Os with flexible multiplexing options
• 8
× general-purpose timers and pulse-width modulation (PWM)
• 3
× universal asynchronous receiver-transmitter (UART)
• 2
× Serial Peripheral Interface (SPI)
• 2
× inter-integrated circuit (I2C)
• Inter-IC
sound (I2S)
• Pulse
density modulation (PDM)
• Secure
digital and multimedia card (SD/MMC)
• Secure digital input output (SDIO) 2.0
• Controller
area network (CAN) 2.0
• 8-channel,
12-bit analog-to-digital converter (ADC)
System Services
• Direct
memory access (DMA)
• One-time-programmable
memory (OTP)
• Real-time
clock (RTC) and watchdog timer (WDT)
Radio
• Wi-Fi 6 (802.11ax)
◦ 2.4GHz and 5GHz, single-stream 20MHz channels with application throughput up to 20Mbps (UDP)
◦ Compatible with IEEE 802.11 a/b/g/n/ax
▪ Orthogonal frequency-division multiple access (OFDMA)
▪ Target wake time (TWT)
▪ Trigger frames
▪ Basic service set (BSS) color
◦ Integrated PA for a complete WLAN system with up to 18 dBm output power at 1 DSSS
◦ Role support: STA, softAP , Wi-Fi direct, multi-role AP + STA
◦ Support for personal and enterprise Wi-Fi security: WPA and WPA2 PSK, WPA2 Enterprise, WPA3 personal or enterprise
◦ Wi-Fi TX Power:
▪ 18 dBm at 1DSSS
▪ 16 dBm at 54OFDM
◦ Wi-Fi RX Sensitivity:
▪ –97 dBm at 1DSSS
▪ –75dBm at 54OFDM
• Bluetooth® Low Energy
◦ Bluetooth Low Energy 5.4 certified stack
◦ Supports long-range and high-speed PHYs (up to 2Mbps)
Security Features
• ARM TrustZone
• Hardware security module supporting all of the following:
◦ ECC, RSA, AES, SHA2/3, MD5, CRC 16/32, and TRNG
◦ Secure key storage
• Initial secure programming
• Secure boot
• Software IP and cloning protection
• Debug security through JTAG and debug port lock
• OTP with the ability to program root-of-trust public key
• Secure over-the-air (OTA) updates
• Anti-rollback protection
Clock Source
• Fast clock: 52MHz XTAL
• Slow clock: Internal low-frequency oscillator, external 32.768kHz XTAL, or external slow clock source
Power Management
• Support for 3.3V and 1.8V on multiple I/O domains
• Supplies:
◦ VDD_3V3: 3.3V
◦ VDD_1V8: 1.8V
◦ VIO1: 1.8/3.3V
◦ VIO2: 1.8/3.3V
Key Benefits
• Complete software development kit with open-source TCP/IP and TLS stacks
• Operating temperature: –40°C to +85°C
• Support for 3-wire PTA coexistence interface for use with external 2.4GHz radios (for example Thread or Zigbee®)
• Antenna selection capability
Memory
• Up to 32MB XiP flash
• Up to 8MB optional PSRAM
Antenna Options
• Integrated PCB trace antenna
• U.FL connector
• ANT pin
Package
• LGA-101, 15mm x 25.5mm x 3.3mm, PCB trace antenna variants
• LGA-101, 15mm x 23.5mm x 3.3mm, U.FL connector variants
• LGA-101, 15mm x 19mm x 3.3mm, ANT pin variants
Certifications - In-progress
• Bluetooth SIG
• FCC
• IC
• MIC
• CE-RED