PCB Footprint

The recommended PCB footprints for the module series are as below figure. All dimensions are in mm.

Figure 1. Recommended PCB Footprints
Note:
  1. Solder mask should be the same or 5% larger than the dimension of the pad.
  2. Solder paste must be the same as the pin for all peripheral pads. For thermal pads, make the solder paste 20% smaller than the pad.
  3. Copper-free means no copper in this area in all layers, including traces, ground or components etc. It is recommended to extend the copper-free area at least 15mm to the left and right. For U.FL variants, ground pour can be applied but avoid signal lines underneath this area.
  4. Customers can modify the land pattern dimensions based on their manufacturing experience.